我爱免费 发表于 2024-5-7 04:19

AI加速数据中心技术发展 - 2024 OCP EMEA Regional Summit 会议资料

作者:企业存储技术


去年的OCP EMEA区域峰会是在布拉格举办,今年在葡萄牙首都里斯本,都是好地方。

2024 OCP EMEA Regional Summit演讲资料网盘分享

https://pan.baidu.com/s/16-xJortO22crHVWd91KYbA?pwd=18qd

提取码:18qd

官网来源https://www.opencompute.org/events/past-events/2024-emea-regional-summit(内含视频链接,qiang外的)

附:部分往届峰会资料

《2023 OCP Global Summit会议资料分享》

《2022 OCP Global Summit会议资料分享》

《2021 OCP Global Summit会议资料下载分享》

《2019 OCP Global Summit会议资料下载 - Part 3》

《2019 OCP Global Summit会议资料下载 - Part 1》

《OCP 2018峰会资料下载:互联网数据中心硬件风向标》

本次议题如下:

Keynotes


2024 OCP EMEARegional Summit - All Keynotes

OCP Intro Video

Welcome to the2024 OCP Regional Summit

Enabling Collaborationfor Innovation & Foundation Innovation Update

CloudEnvironmental Impact: OVHcloud’s Positioning and Solutions

Transforming theData Center - Scaling Computing Infrastructure Sustainably

Bringing AIEverywhere - Presented by Intel

PANEL - The roleof startups and VC in the OCP Ecosystem

The EUPILOT:Europe’s OCP-Based HPC and AI pre-exascale accelerator demonstrator

Stranded Capacityin Data Centers is Costing the Earth

PANEL -De-Mystifying European Sustainability Directives

Trusted Cloud:Journey of Open Hardware Innovation - Presented by Microsoft

AI for All: Pathtowards an open AI Infrastructure - Presented by Meta





Executive Session


AI adoption andthe challenges to develop and scale real world hardware - presented by RittalGmbH & Co. KG

Direct-to-ChipLiquid Cooling AI Cluster Architectures Inspired by OCP Principles andTechnologies - presented by Supermicro

EnablingSustainability, Scalability and Security via Platform Firmware - presented byAMI

Quantum Journey ofOpen Hardware Innovation - Presented by Microsoft

Real-Life OCPDeployments and Migrations - presented by Circle B

Scaling Systemsfor Gen AI - presented by Intel

Future Technologies Symposium


Air or liquidcooled servers – the right product for the right place!

Analog In-memorycomputing with multilevel memristive devices for high performance computing

Breaking thebarrier, chip level cooling up to and beyond 1000W in single phase dielectricfluid

Ceramic NanoMemory enabling the AI Storage Dataverse

Chiplet-BasedCompressed LLC Cache & Memory Expansion

DeliveringPerformant AI Solutions

Direct-to-chip,Two-Phase Cooling Performance Metrics and PFAS Sustainability

FTS Announcement

FTS Wrap-up

Large MemoryServer Design Overview

Novel PowerOptimization Methods for AI/HPC Chips: Workload-Aware Adaptive VoltageScaling

OCP FTS Welcomeand Kickoff

Silicon Dreams:Toward the AI Singularity





如果把32个E3.S前置位换成OMI内存,OpenPOWER这么玩还有前途吗?
SONiC Workshop (hosted by Stordis)


Connectivity asSoftware

Disaggregatedwhite box with community SONiC: barriers and solutions towardsdeployment-readiness

DrivingPerformance: Efficient Networking for AI Infrastructure

Migrating to SONiCFabrics: from Campus Networks to Telco Edge Solutions

Migration fromCumulus to SONiC at metal-stack.io

Open Networking inthe Sovereign Cloud Stack Project

Pioneering OpenNetworking with STORDIS: Harnessing Open Sources for SONiC, Monsoon, andAI-Enhanced ORCA

Simple & SmartConfiguration using GIT for Mid-sized Companies

SONiC BootcampGreetings and Introduction

SONiC DistributionFreedom

SONiC is coming tothe Enterprise

The Final Link:Wrapping Up and Looking Ahead with SONiC

Artificial Intelligence (AI)


ArtificialIntelligence (AI) Track Kickoff

Chiplets forgenerative AI

CXL Solutions forKey AI Problems

Harnessing thePower of AI/ML to Enhance SAI Testing

NVIDIA Spectrum-XNetwork Platform Architecture

Optcast:Open-Source Aggregation Offloading for Distributed Deep Learning

Q&A:Economically Viable System Architectures for AI

Q&A:Networking for AI Workloads: Opportunities and Challenges

Scheduled EthernetFabric for Large scale AI training cluster

The Case forComputational Offload to CXL Memory Devices for AI Workloads



DC Sustainability


A HolisticApproach to Carbon Modelling of Emission Scopes 1, 2, 3 and 4 Integrating BIMin Decision Making for Start Campus’ Net Zero Mission

Accelerating theDevelopment and Implementation of Low-Carbon Concrete for Data CenterConstruction

Addressing CarbonEmission Quantification Challenges in Hardware Manufacturing and DatacenterOperations

Challenges of liveenvironmental footprint reporting

DC FacilitySustainability Project Status Updates

Efficiency 101:Data Centers' Guide to the New European Regulations

Energy-AwareWorkload Orchestration on OCP Servers using Kubernetes

EnhancingTelecommunications for the Future: Integrating Sustainability and Efficiencyinto Central Offices

Increasing EnergyEfficiency of Server Cooling Over Traditional Methods with a DeepReinforcement Learning Agents running on an OCP Compliant BMC platforms

Leveling thePlaying Field: Industry Standard Benchmarks and OCP

Life CycleAssessment of the Open Rack 3, Steel vs. CLT models

Lifecycle analysison servers – going from servers to components to precious metals

Measuring CarbonEmissions in Cloud Environments - An Introduction to the ECO:DIGIT project

Net ZeroInnovation Hub

OCP undergroundhyperscalers enables compliance of Energy Efficiency Act

PANEL: iMason ClimateAccord & OCP: Carbon Disclosure Project Update

Participating inan Open Hardware Ecosystem

SustainabilityMetrics - Infrastructure Utilization Efficiency (IUE) considerations

Telemetry enhancedgreen coding – how detailed telemetry can contribute to sustainability goals

The creation of acircular economy-based cloud service: New key takeaways and lessons learned



这里的欧盟不包括英国
EMEA Deployments


A Practical Guideto Disaggregated Networking: IP Infusion, Madeo and Prosoluce Present theKeys to Success

Automating theMigration Journey to Open-Standards Networks

Building asustainable management infrastructure with open source firmware

Coherent Optics :Why they don't just work in my switch

Empowering CloudSovereignty: Building a Resilient Open Cloud Ecosystem in Germany

How alternativematerials can address industry challenges? The Universal Quick Disconnectscase in liquid cooling.

How InnovativeOpen Networking helps improve day to day business in a Large PublicUniversity

OCP Ready™ forHyperscale v2: Aligning the Industry on data center requirements forhyperscaler deployments

Scaling Down WhileScaling Up – Design Choices That Increase Efficiency & Performance

Steve Helvie (VPof Emerging Markets for OCP) - How Europe is viewing the OCP Marketplace

Power and Cooling


Adopting BestPractices: Warranty Guidelines for Immersion Cooled Computing

CE Cold PlateSubproject Overview

CoolingEnvironments Project Overview & Roadmap for a Durable Chip CoolantTemperature

DC-Power: Usingmedium voltage DC grids to reduce data center losses

Dielectric ColdPlate based Modular Data Center

Door HeatExchanger Requirements for Open Rack

Heat reusesubproject - Policies + Economics Workstreams + Reference designs

Integrating PowerDelivery in Immersion Tanks: Challenges and Opportunities

IntegratingStandards and Economics: Shaping the Future of Immersion Cooling

Liquid CoolingBazaar

Navigating theEvolution and Challenges of OCP Immersion Cooling

Novel HybridImmersion Liquid Cooling Technique for Data Center

OCP Modular DataCenter Working Group Update

OCP Orv3 BlindMate Liquid Cooling Overview and Updates

Optimizing SignalIntegrity in Immersion-Cooled IT Platforms

ORv3 High PowerRack (HPR) Ecosystem Solution

Panel:Past-Present-Future of heat reuse

Requirements/Considerationsof Next Generation ORv3 PSU and Power Shelves

Safe HandlingGuidelines for Immersion Fluids

Single phaseimmersion cooling developments – Research Institutes of Sweden OCP ExperienceCenter working with Castrol

SustainableInnovations in Immersion Cooling: Fluids, Materials, and Lifecycle Management



冷板与浸没液冷的混合?
Security and Data Protection


Adam’s BridgeAccelerator

Attested TLS andformalization

EmpoweringFirmware Security: The Indispensable Role of SBOM for End Users

OCP Flashless BootUpdate

OCP L.O.C.K.

OCP S.A.F.E.Update

Project CaliptraUpdate

Providingcertifiable secure hardware subsystems with anti-tamper mechanisms

Recent andUpcoming Security Trends in Cloud Low-level Hardware Devices: A Survey

Recovery fromfirmware vulnerabilities in TPM

Sustainable Scalable Computational Infrastructure


Assured PNT forData Centers, All you need to know

Chiplet basedReconfigurable OCP Accelerator Module (OAM) architecture and platform

Data Center LifeCycle Manageability @ Scale

Data CenterModular Hardware System Specification (DC-MHS) the overview

DC-MHS ModularShared Infrastructure (M-SIF)

Hardening GNSSTime - A Method to Counter Spoofing Attacks

Leveraging OCP toCreate a Purpose Built ARM Processor

OCP ComposableMemory Systems (CMS) Sub-Project progress update and plans

OpenLANcloud-managed Switches running open-source SONiC

PCIe Add-In-Cards(CXL, NIC) Out-Of-Band manageability in Data Centers

PCIe Expresscorrected errors handling (RAS) solution implementation considerations inMeta's AI/ML Training Clusters

Power at allcosts?

Progress towardsan Open & Sustainable, Energy Centric Computing Architecture for today’sAI & HPC Applications

Sensor Discoveryand Manageability for Pluggable DC-MHS Designs

Streamlining CXLAdoption for Hyperscale Efficiency

Why chiplet willtransform the semiconductor ecosystem from design to packaging?



注意:上图中的OAM CMM是CXL内存模块哦。
Special Focus: OpenRAN


5G Open RAN andEdge Deployments in Europe

5G Open RANecosystem in India

Building theOpenRAN edge cloud with open hardware including open radio

CapGemini view ofOpenRAN and potential for an Open Radio Platform

ETSI ActivitiesSupporting OpenRAN and Open Radio Platform

i14Y role inOpenRAN and potential for an Open Radio Platform

ManufacturingCarrier Grade Radios

OCP EvenstarProject Update

OpenRAN Challengesand Opportunities for NOS

OpenRAN MarketOverview and Strategies

Panel: BreakingDown Barriers to OpenRAN

Special Focus: Optics for AI Clusters


Advancements inLinear Drive Pluggable Optics for High-Speed Data Interconnects

Augmented SiliconPhotonics for Data Center and AI/ML optical interconnects

Chip-scale LaserCombs for Connectivity of AI Custers

Coherent Opticsfor Artificial Intelligence

Market Overview

Optical CXL fordisaggregated compute architectures

Optics in AIClusters - Meta Perspective

PANEL: Theevolving role of optics in AI Clusters

Re-configurablePhotonic Interconnects for AI/ML Infrastructure

Technology CaseStudy

Wrap Up Comments

Special Focus: Quantum


A Blueprint forQuantum Networking

Emerging QuantumStandards

Practicality ofDeploying and Managing Quantum Networks

Quantum Computers& Simulators in HPC Centres

Quantum Computingfor Life Science Simulations and Optimizations

QuantumEmpowerment: Navigating the Quantum Revolution for Businesses

Quantum ErrorCorrection

Quantum TechnologyOverview (Computing and Communications)

Scaling theQuantum Computer

Self-certificationfor entropy generation

The BridgeAccelerator


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